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電子產業一站式服務平臺
0755-83688678可制造性設計
列出常見不合理的設計缺陷，它會導致生產不了或影響生產效率
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箭頭所指處線路是否異常，建議去除調整. 
2023/05/23
9047
1
SMD封裝設計規范焊盤中心距離等于引腳中心距，封裝設計時1腳的方向要與料盤元件1腳的方向保持一致。
PCB布線不合理 PCB布線常規要≥4mil，空間不足的地方可以布3.5mil或3mil。下圖走線間距為2.5mil，線旁邊為銅皮有足夠空間優化。 建議：類似這樣的優化一下銅皮，按線寬/線距 4/4mil布，提升生產良率，保證PCB的可靠性 
PCB過孔到線距離太近孔邊到線邊間距不足7mil ，生產時孔環過小會影響載流。建議將過孔邊緣與線的邊緣加大，最優的間距為≥8mil。 
pcb按鍵板設計，線路層鋪銅異常 PCB按鍵設計，通過觸動實現控制。此文件按鍵周邊的鋪銅出銅皮丟失問題，鋪銅的輪廓線過粗造成短路。建議：重新優化PCB板的鋪銅 
